FW241 applications equivalent, ultrahigh-speed swiching applications.
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Package Dimensions
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4.4
6.0
0.2
0.3
5.0
This composite device allows high density mounting by unit : mm incorporating two MOSFET chips in one package tha.
Features
*
Package Dimensions
*
4.4
6.0
0.2
0.3
5.0
This composite device allows high density mounting by .
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